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Chemical content 74AXP1T125GS

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Type numberPackagePackage descriptionTotal product weight
74AXP1T125GSSOT1202X2SON60.96914 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935306987125912601235Seremban, Malaysia; Bangkok, Thailand; Singapore, Singapore 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03565100.000003.67842
subTotal0.03565100.000003.67842
ComponentAdditiveNon hazardousProprietary0.000255.000000.02580
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02580
Silica -amorphous-7631-86-90.0025050.000000.25796
PolymerEpoxy resin systemProprietary0.0015030.000000.15478
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05159
subTotal0.00500100.000000.51593
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100041.05569
Magnesium (Mg)7439-95-40.000630.150000.06516
Nickel (Ni)7440-02-00.012422.950001.28150
Silicon (Si)7440-21-30.002690.640000.27802
Pure metal layerGold (Au)7440-57-50.000080.020000.00869
Nickel (Ni)7440-02-00.006901.640000.71243
Palladium (Pd)7440-05-30.000380.090000.03910
subTotal0.42100100.0000043.44059
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20772
FillerSilica -amorphous-7631-86-90.001420.290000.14692
Silica fused60676-86-00.4230086.1500043.64658
HardenerPhenolic resinProprietary0.021064.290002.17346
PigmentCarbon black1333-86-40.000930.190000.09626
PolymerEpoxy resin systemProprietary0.042578.670004.39252
subTotal0.49100100.0000050.66346
WireGold alloyGold (Au)7440-57-50.0163399.000001.68500
Palladium (Pd)7440-05-30.000161.000000.01702
subTotal0.01650100.000001.70202
total0.96914100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.