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Chemical content 74AXP1T32GX

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Type numberPackagePackage descriptionTotal product weight
74AXP1T32GXSOT1255-2X2SON60.74425 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935308977147912601235Singapore, Singapore; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03565100.000004.78992
subTotal0.03565100.000004.78992
ComponentAdditiveNon hazardousProprietary0.000255.000000.03359
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.03359
Silica -amorphous-7631-86-90.0025050.000000.33591
PolymerEpoxy resin systemProprietary0.0015030.000000.20155
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.06718
subTotal0.00500100.000000.67182
Lead FrameCopper alloyCopper (Cu)7440-50-80.2740894.5100036.82620
Magnesium (Mg)7439-95-40.000440.150000.05845
Nickel (Ni)7440-02-00.008562.950001.14948
Silicon (Si)7440-21-30.001860.640000.24938
Pure metal layerGold (Au)7440-57-50.000060.020000.00779
Nickel (Ni)7440-02-00.004761.640000.63903
Palladium (Pd)7440-05-30.000260.090000.03507
subTotal0.29000100.0000038.96540
Mould CompoundAdditiveNon hazardousProprietary0.001630.410000.21925
FillerSilica -amorphous-7631-86-90.001150.290000.15508
Silica fused60676-86-00.3428886.1500046.07014
HardenerPhenolic resinProprietary0.017074.290002.29415
PigmentCarbon black1333-86-40.000760.190000.10161
PolymerEpoxy resin systemProprietary0.034518.670004.63643
subTotal0.39800100.0000053.47666
WireGold alloyGold (Au)7440-57-50.0154599.000002.07577
Palladium (Pd)7440-05-30.000161.000000.02097
subTotal0.01560100.000002.09674
total0.74425100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.