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Chemical content 74AXP1T34GM

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Type numberPackagePackage descriptionTotal product weight
74AXP1T34GMSOT886XSON61.93542 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935306991125812601235Singapore, Singapore; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07130100.000003.68385
subTotal0.07130100.000003.68385
ComponentAdditiveNon hazardousProprietary0.000255.000000.01292
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01292
Silica -amorphous-7631-86-90.0025050.000000.12917
PolymerEpoxy resin systemProprietary0.0015030.000000.07750
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02583
subTotal0.00500100.000000.25834
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100037.69813
Magnesium (Mg)7439-95-40.001160.150000.05983
Nickel (Ni)7440-02-00.022772.950001.17670
Silicon (Si)7440-21-30.004940.640000.25528
Pure metal layerGold (Au)7440-57-50.000150.020000.00798
Nickel (Ni)7440-02-00.012661.640000.65416
Palladium (Pd)7440-05-30.000690.090000.03590
subTotal0.77200100.0000039.88798
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22582
FillerSilica -amorphous-7631-86-90.003090.290000.15973
Silica fused60676-86-00.9183686.1500047.45011
HardenerPhenolic resinProprietary0.045734.290002.36287
PigmentCarbon black1333-86-40.002030.190000.10465
PolymerEpoxy resin systemProprietary0.092428.670004.77530
subTotal1.06600100.0000055.07848
WireGold alloyGold (Au)7440-57-50.0209199.000001.08058
Palladium (Pd)7440-05-30.000211.000000.01091
subTotal0.02112100.000001.09149
total1.93542100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.