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Chemical content 74AXP1T34GX

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Type numberPackagePackage descriptionTotal product weight
74AXP1T34GXSOT1226-3X2SON50.61720 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935306995125912601235Seremban, Malaysia; Bangkok, Thailand; Singapore, Singapore 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03565100.000005.77592
subTotal0.03565100.000005.77592
ComponentAdditiveNon hazardousProprietary0.000205.000000.03240
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03240
Silica -amorphous-7631-86-90.0020050.000000.32404
PolymerEpoxy resin systemProprietary0.0012030.000000.19443
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06481
subTotal0.00400100.000000.64808
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100038.74114
Magnesium (Mg)7439-95-40.000380.150000.06149
Nickel (Ni)7440-02-00.007462.950001.20925
Silicon (Si)7440-21-30.001620.640000.26235
Pure metal layerGold (Au)7440-57-50.000050.020000.00820
Nickel (Ni)7440-02-00.004151.640000.67226
Palladium (Pd)7440-05-30.000230.090000.03689
subTotal0.25300100.0000040.99158
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.20726
FillerSilica -amorphous-7631-86-90.000900.290000.14660
Silica fused60676-86-00.2687986.1500043.54958
HardenerPhenolic resinProprietary0.013384.290002.16863
PigmentCarbon black1333-86-40.000590.190000.09605
PolymerEpoxy resin systemProprietary0.027058.670004.38276
subTotal0.31200100.0000050.55088
WireGold alloyGold (Au)7440-57-50.0124299.000002.01304
Palladium (Pd)7440-05-30.000131.000000.02033
subTotal0.01255100.000002.03337
total0.61720100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.