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Chemical content 74AXP1T57GX

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Type numberPackagePackage descriptionTotal product weight
74AXP1T57GXSOT1233-2X2SON81.03766 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935308434115812601235Seremban, Malaysia; Suzhou, China; Singapore, Singapore; Ayutthaya, Thailand; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03565100.000003.43552
subTotal0.03565100.000003.43552
ComponentAdditiveNon hazardousProprietary0.000255.000000.02409
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02409
Silica -amorphous-7631-86-90.0025050.000000.24093
PolymerEpoxy resin systemProprietary0.0015030.000000.14456
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.04819
subTotal0.00500100.000000.48186
Lead FrameCopper alloyCopper (Cu)7440-50-80.3865594.5100037.25169
Magnesium (Mg)7439-95-40.000610.150000.05912
Nickel (Ni)7440-02-00.012072.950001.16276
Silicon (Si)7440-21-30.002620.640000.25226
Pure metal layerGold (Au)7440-57-50.000080.020000.00788
Nickel (Ni)7440-02-00.006711.640000.64642
Palladium (Pd)7440-05-30.000370.090000.03547
subTotal0.40900100.0000039.41560
Mould CompoundAdditiveNon hazardousProprietary0.002300.410000.22206
FillerSilica -amorphous-7631-86-90.001630.290000.15706
Silica fused60676-86-00.4841686.1500046.65912
HardenerPhenolic resinProprietary0.024114.290002.32348
PigmentCarbon black1333-86-40.001070.190000.10290
PolymerEpoxy resin systemProprietary0.048738.670004.69570
subTotal0.56200100.0000054.16032
WireGold alloyGold (Au)7440-57-50.0257599.000002.48201
Palladium (Pd)7440-05-30.000261.000000.02507
subTotal0.02602100.000002.50708
total1.03766100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.