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Chemical content 74AXP2G14GX

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Type numberPackagePackage descriptionTotal product weight
74AXP2G14GXSOT1255-2X2SON60.73412 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935307133147812601235Seremban, Malaysia; Bangkok, Thailand; Singapore, Singapore 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02387100.000003.25210
subTotal0.02387100.000003.25210
ComponentAdditiveNon hazardousProprietary0.000255.000000.03405
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.03405
Silica -amorphous-7631-86-90.0025050.000000.34054
PolymerEpoxy resin systemProprietary0.0015030.000000.20433
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.06811
subTotal0.00500100.000000.68108
Lead FrameCopper alloyCopper (Cu)7440-50-80.2740894.5100037.33436
Magnesium (Mg)7439-95-40.000440.150000.05925
Nickel (Ni)7440-02-00.008562.950001.16534
Silicon (Si)7440-21-30.001860.640000.25282
Pure metal layerGold (Au)7440-57-50.000060.020000.00790
Nickel (Ni)7440-02-00.004761.640000.64785
Palladium (Pd)7440-05-30.000260.090000.03555
subTotal0.29000100.0000039.50307
Mould CompoundAdditiveNon hazardousProprietary0.001630.410000.22228
FillerSilica -amorphous-7631-86-90.001150.290000.15722
Silica fused60676-86-00.3428886.1500046.70585
HardenerPhenolic resinProprietary0.017074.290002.32581
PigmentCarbon black1333-86-40.000760.190000.10301
PolymerEpoxy resin systemProprietary0.034518.670004.70040
subTotal0.39800100.0000054.21457
WireGold alloyGold (Au)7440-57-50.0170799.000002.32558
Palladium (Pd)7440-05-30.000171.000000.02349
subTotal0.01724100.000002.34907
total0.73412100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.