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Chemical content 74AXP2G17GN

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Type numberPackagePackage descriptionTotal product weight
74AXP2G17GNSOT1115X2SON60.86651 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935306637125812601235Singapore, Singapore; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02387100.000002.75523
subTotal0.02387100.000002.75523
ComponentAdditiveNon hazardousProprietary0.000255.000000.02885
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02885
Silica -amorphous-7631-86-90.0025050.000000.28851
PolymerEpoxy resin systemProprietary0.0015030.000000.17311
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05770
subTotal0.00500100.000000.57702
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100041.99184
Magnesium (Mg)7439-95-40.000580.150000.06665
Nickel (Ni)7440-02-00.011362.950001.31072
Silicon (Si)7440-21-30.002460.640000.28436
Pure metal layerGold (Au)7440-57-50.000080.020000.00889
Nickel (Ni)7440-02-00.006311.640000.72867
Palladium (Pd)7440-05-30.000350.090000.03999
subTotal0.38500100.0000044.43112
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20583
FillerSilica -amorphous-7631-86-90.001260.290000.14558
Silica fused60676-86-00.3747586.1500043.24849
HardenerPhenolic resinProprietary0.018664.290002.15364
PigmentCarbon black1333-86-40.000830.190000.09538
PolymerEpoxy resin systemProprietary0.037718.670004.35246
subTotal0.43500100.0000050.20138
WireGold alloyGold (Au)7440-57-50.0174699.000002.01482
Palladium (Pd)7440-05-30.000181.000000.02035
subTotal0.01764100.000002.03517
total0.86651100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.