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Chemical content 74AXP2T3407GS

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Type numberPackagePackage descriptionTotal product weight
74AXP2T3407GSSOT1203X2SON81.32493 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935306976115812601235Suzhou, China; Ayutthaya, Thailand; Seremban, Malaysia; Singapore, Singapore; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03565100.000002.69063
subTotal0.03565100.000002.69063
ComponentAdditiveNon hazardousProprietary0.000305.000000.02264
FillerBisphenol A-epichlorohydrin resin25068-38-60.000305.000000.02264
Silica -amorphous-7631-86-90.0030050.000000.22643
PolymerEpoxy resin systemProprietary0.0018030.000000.13586
Phenol Formaldehyde resin (generic)9003-35-40.0006010.000000.04529
subTotal0.00600100.000000.45286
Lead FrameCopper alloyCopper (Cu)7440-50-80.5443894.5100041.08727
Magnesium (Mg)7439-95-40.000860.150000.06521
Nickel (Ni)7440-02-00.016992.950001.28248
Silicon (Si)7440-21-30.003690.640000.27823
Pure metal layerGold (Au)7440-57-50.000120.020000.00869
Nickel (Ni)7440-02-00.009451.640000.71297
Palladium (Pd)7440-05-30.000520.090000.03913
subTotal0.57600100.0000043.47398
Mould CompoundAdditiveNon hazardousProprietary0.002800.410000.21135
FillerSilica -amorphous-7631-86-90.001980.290000.14949
Silica fused60676-86-00.5884086.1500044.41023
HardenerPhenolic resinProprietary0.029304.290002.21149
PigmentCarbon black1333-86-40.001300.190000.09794
PolymerEpoxy resin systemProprietary0.059228.670004.46938
subTotal0.68300100.0000051.54988
WireGold alloyGold (Au)7440-57-50.0240499.000001.81422
Palladium (Pd)7440-05-30.000241.000000.01833
subTotal0.02428100.000001.83255
total1.32493100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.