×

Chemical content 74HC05BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC05BQ-Q100SOT762-1DHVQFN1418.15763 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298734115512601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10261
PolymerResin systemProprietary0.0046319.900000.02549
subTotal0.02326100.000000.12810
DieDoped siliconSilicon (Si)7440-21-30.18104100.000000.99705
subTotal0.18104100.000000.99705
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.14532
Iron (Fe)7439-89-60.166072.400000.91463
Phosphorus (P)7723-14-00.002080.030000.01143
Zinc (Zn)7440-66-60.006920.100000.03811
subTotal6.91978100.0000038.10949
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68597
FillerSilica -amorphous-7631-86-90.367153.490002.02201
Silica fused60676-86-08.9230784.8200049.14228
PigmentCarbon black1333-86-40.016830.160000.09270
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62572
Epoxy resin systemProprietary0.167271.590000.92120
Phenolic resinProprietary0.236702.250001.30359
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14367
subTotal10.52001100.0000057.93714
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07623
Nickel (Ni)7440-02-00.4258792.300002.34542
Palladium (Pd)7440-05-30.014303.100000.07877
Silver (Ag)7440-22-40.007381.600000.04066
subTotal0.46140100.000002.54108
WirePure metalCopper (Cu)7440-50-80.0503496.550000.27724
Pure metal layerGold (Au)7440-57-50.000180.350000.00101
Palladium (Pd)7440-05-30.001623.100000.00890
subTotal0.05214100.000000.28715
total18.15763100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.