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Chemical content 74HC138DB

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Type numberPackagePackage descriptionTotal product weight
74HC138DBSOT338-1SSOP16126.88773 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351744101182112601235Jiangyin, China; Suzhou, China; Shanghai, China; Bangkok, Thailand; Nijmegen, NetherlandsLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-47.5000075.000005.91074
PolymerResin systemProprietary2.5000025.000001.97025
subTotal10.00000100.000007.88099
DieDoped siliconSilicon (Si)7440-21-30.34137100.000000.26903
subTotal0.34137100.000000.26903
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.8772697.4700037.73199
Iron (Fe)7439-89-61.178882.400000.92907
Phosphorus (P)7723-14-00.014740.030000.01161
Zinc (Zn)7440-66-60.049120.100000.03871
subTotal49.12000100.0000038.71138
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-750.2500075.0000039.60194
Flame retardantAntimony Trioxide (Sb2O3)1309-64-41.474002.200001.16166
Misc. Bromine compounds (generic)Proprietary1.072001.600000.84484
PolymerEpoxy resin systemProprietary14.2040021.2000011.19415
subTotal67.00000100.0000052.80259
Pre-PlatingPure metal layerGold (Au)7440-57-50.002001.000000.00158
Nickel (Ni)7440-02-00.1940097.000000.15289
Palladium (Pd)7440-05-30.004002.000000.00315
subTotal0.20000100.000000.15762
WirePure metalGold (Au)7440-57-50.2241099.000000.17661
Palladium (Pd)7440-05-30.002261.000000.00178
subTotal0.22636100.000000.17839
total126.88773100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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