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Chemical content 74HC193D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC193D-Q100SOT109-1SO16163.87946 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300445118812601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.00951
PolymerAcrylic resinProprietary0.0030415.200000.00186
Resin systemProprietary0.001386.900000.00084
subTotal0.02000100.000000.01221
DieDoped siliconSilicon (Si)7440-21-32.04884100.000001.25021
subTotal2.04884100.000001.25021
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6301297.4700033.33555
Iron (Fe)7439-89-61.345162.400000.82082
Phosphorus (P)7723-14-00.016810.030000.01026
Zinc (Zn)7440-66-60.056050.100000.03420
subTotal56.04814100.0000034.20083
Mould CompoundAdditiveNon hazardousProprietary4.899614.700002.98976
FillerSilica fused60676-86-082.3551379.0000050.25348
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.254826.000003.81672
PigmentCarbon black1333-86-40.208490.200000.12722
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.169884.000002.54448
Non hazardousProprietary4.274134.100002.60809
Tetramethylbiphenyl diglycidyl ether85954-11-62.084942.000001.27224
subTotal104.24700100.0000063.61199
Pre-PlatingPure metal layerGold (Au)7440-57-50.042683.000000.02605
Nickel (Ni)7440-02-01.3132192.300000.80133
Palladium (Pd)7440-05-30.044113.100000.02691
Silver (Ag)7440-22-40.022761.600000.01389
subTotal1.42276100.000000.86818
WirePure metalCopper (Cu)7440-50-80.09272100.000000.05658
subTotal0.09272100.000000.05658
total163.87946100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.