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Chemical content 74HC1G00GV

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Type numberPackagePackage descriptionTotal product weight
74HC1G00GVSOT753SO510.37538 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352720101251712601235Shanghai, China; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.07229
PolymerResin systemProprietary0.0025025.000000.02410
subTotal0.01000100.000000.09639
DieDoped siliconSilicon (Si)7440-21-30.08038100.000000.77477
subTotal0.08038100.000000.77477
Lead FrameCopper alloyCopper (Cu)7440-50-83.1906694.9600030.75218
Iron (Fe)7439-89-60.085682.550000.82580
Lead (Pb)7439-92-10.001010.030000.00972
Phosphorus (P)7723-14-00.005040.150000.04858
Tin (Sn)7440-31-50.006720.200000.06477
Pure metal layerSilver (Ag)7440-22-40.070902.110000.68331
subTotal3.36000100.0000032.38436
Mould CompoundFillerSilica fused60676-86-04.6008071.0000044.34344
PigmentCarbon black1333-86-40.019440.300000.18737
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2765619.7000012.30374
Phenolic resinProprietary0.583209.000005.62100
subTotal6.48000100.0000062.45555
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00013
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000020.005000.00021
Tin solderTin (Sn)7440-31-50.4399699.990004.24038
subTotal0.44000100.000004.24080
WireGold alloyGold (Au)7440-57-50.0049599.000000.04771
Palladium (Pd)7440-05-30.000051.000000.00048
subTotal0.00500100.000000.04819
total10.37538100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.