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Chemical content 74HC2G32DC

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Type numberPackagePackage descriptionTotal product weight
74HC2G32DCSOT765-1VSSOP89.98163 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352748231251112601235Suzhou, China; Bangkok, Thailand; Ayutthaya, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28761
PolymerResin systemProprietary0.0071319.900000.07145
subTotal0.03584100.000000.35906
DieDoped siliconSilicon (Si)7440-21-30.13079100.000001.31035
subTotal0.13079100.000001.31035
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000034.04805
Nickel (Ni)7440-02-00.105113.000001.05303
subTotal3.50366100.0000035.10108
Mould CompoundAdditiveNon hazardousProprietary0.290574.700002.91103
FillerSilica fused60676-86-04.8840279.0000048.93005
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.370946.000003.71621
PigmentCarbon black1333-86-40.012360.200000.12387
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.247294.000002.47747
Non hazardousProprietary0.253474.100002.53941
Tetramethylbiphenyl diglycidyl ether85954-11-60.123652.000001.23874
subTotal6.18230100.0000061.93678
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03094
Nickel (Ni)7440-02-00.0950292.300000.95198
Palladium (Pd)7440-05-30.003193.100000.03197
Silver (Ag)7440-22-40.001651.600000.01650
subTotal0.10295100.000001.03139
WirePure metalCopper (Cu)7440-50-80.02608100.000000.26133
subTotal0.02608100.000000.26133
total9.98163100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.