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Chemical content 74HC4067DB

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Type numberPackagePackage descriptionTotal product weight
74HC4067DBSOT340-1SSOP24175.39820 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351652001182412601235Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand; Suzhou, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-41.5855075.500000.90394
PolymerResin systemProprietary0.5145024.500000.29333
subTotal2.10000100.000001.19727
DieDoped siliconSilicon (Si)7440-21-31.67089100.000000.95263
subTotal1.67089100.000000.95263
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-871.4065297.4700040.71109
Iron (Fe)7439-89-61.758242.400001.00243
Phosphorus (P)7723-14-00.021980.030000.01253
Zinc (Zn)7440-66-60.073260.100000.04177
subTotal73.26000100.0000041.76782
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-772.5325075.0000041.35305
Flame retardantAntimony Trioxide (Sb2O3)1309-64-42.127622.200001.21302
Misc. Bromine compounds (generic)Proprietary1.547361.600000.88220
PolymerEpoxy resin systemProprietary20.5025221.2000011.68913
subTotal96.71000100.0000055.13740
Pre-PlatingPure metal layerGold (Au)7440-57-50.013401.000000.00764
Nickel (Ni)7440-02-01.2998097.000000.74106
Palladium (Pd)7440-05-30.026802.000000.01528
subTotal1.34000100.000000.76398
WirePure metalGold (Au)7440-57-50.3141399.000000.17910
Palladium (Pd)7440-05-30.003171.000000.00181
subTotal0.31731100.000000.18091
total175.39820100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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