Chemical content 74HC4514D

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Type number	Package	Package description	Total product weight
74HC4514D	SOT137-1	SO24	613.99674 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
933715670653	16	1	260		1	235			Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silver (Ag)	7440-22-4	3.08795	75.50000	0.50293
	Polymer	Resin system	Proprietary	1.00205	24.50000	0.16320
		subTotal		4.09000	100.00000	0.66613

Die	Doped silicon	Silicon (Si)	7440-21-3	3.58062	100.00000	0.58317
		subTotal		3.58062	100.00000	0.58317

Lead Frame Material	Copper alloy	Copper (Cu)	7440-50-8	179.26682	97.47000	29.19671
		Iron (Fe)	7439-89-6	4.41408	2.40000	0.71891
		Phosphorus (P)	7723-14-0	0.05518	0.03000	0.00899
		Zinc (Zn)	7440-66-6	0.18392	0.10000	0.02995
		subTotal		183.92000	100.00000	29.95456

Mould Compound	Filler	Misc. Silica compounds (generic)	14808-60-7	313.43250	75.00000	51.04791
	Flame retardant	Antimony Trioxide (Sb2O3)	1309-64-4	9.19402	2.20000	1.49741
		Misc. Bromine compounds (generic)	Proprietary	6.68656	1.60000	1.08902
	Polymer	Epoxy resin system	Proprietary	88.59692	21.20000	14.42954
		subTotal		417.91000	100.00000	68.06388

Pre-Plating	Pure metal layer	Gold (Au)	7440-57-5	0.04150	1.00000	0.00676
		Nickel (Ni)	7440-02-0	4.02550	97.00000	0.65562
		Palladium (Pd)	7440-05-3	0.08300	2.00000	0.01352
		subTotal		4.15000	100.00000	0.67590

Wire	Pure metal	Gold (Au)	7440-57-5	0.34266	99.00000	0.05581
		Palladium (Pd)	7440-05-3	0.00346	1.00000	0.00056
		subTotal		0.34612	100.00000	0.05637

		total		613.99674	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.