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Chemical content 74HC4514PW

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Type numberPackagePackage descriptionTotal product weight
74HC4514PWSOT355-1TSSOP2490.20283 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352624151181812601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1648177.900000.18271
PolymerAcrylic resinProprietary0.0321615.200000.03565
Resin systemProprietary0.014606.900000.01618
subTotal0.21157100.000000.23454
DieDoped siliconSilicon (Si)7440-21-33.58062100.000003.96952
subTotal3.58062100.000003.96952
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-834.7610397.4700038.53652
Iron (Fe)7439-89-60.855922.400000.94888
Phosphorus (P)7723-14-00.010700.030000.01186
Zinc (Zn)7440-66-60.035660.100000.03954
subTotal35.66331100.0000039.53680
Mould CompoundAdditiveNon hazardousProprietary2.314444.700002.56581
FillerSilica fused60676-86-038.9022179.0000043.12748
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.954606.000003.27550
PigmentCarbon black1333-86-40.098490.200000.10918
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.969734.000002.18367
Non hazardousProprietary2.018984.100002.23826
Tetramethylbiphenyl diglycidyl ether85954-11-60.984872.000001.09183
subTotal49.24330100.0000054.59173
Pre-PlatingPure metal layerGold (Au)7440-57-50.041453.000000.04596
Nickel (Ni)7440-02-01.2754292.300001.41395
Palladium (Pd)7440-05-30.042843.100000.04749
Silver (Ag)7440-22-40.022111.600000.02451
subTotal1.38182100.000001.53191
WirePure metalCopper (Cu)7440-50-80.12222100.000000.13549
subTotal0.12222100.000000.13549
total90.20283100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.