×

Chemical content 74HC540DB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC540DBSOT339-1SSOP20156.40515 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351901301181912601235Bangkok, Thailand; Suzhou, China; Nijmegen, NetherlandsLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.3926075.500000.25101
PolymerResin systemProprietary0.1274024.500000.08146
subTotal0.52000100.000000.33247
DieDoped siliconSilicon (Si)7440-21-32.28547100.000001.46125
subTotal2.28547100.000001.46125
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-867.5662097.4700043.19948
Iron (Fe)7439-89-61.663682.400001.06370
Phosphorus (P)7723-14-00.020800.030000.01330
Zinc (Zn)7440-66-60.069320.100000.04432
subTotal69.32000100.0000044.32080
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-762.0100075.0000039.64703
Flame retardantAntimony Trioxide (Sb2O3)1309-64-41.818962.200001.16298
Misc. Bromine compounds (generic)Proprietary1.322881.600000.84580
PolymerEpoxy resin systemProprietary17.5281621.2000011.20689
subTotal82.68000100.0000052.86270
Pre-PlatingPure metal layerGold (Au)7440-57-50.014001.000000.00895
Nickel (Ni)7440-02-01.3580097.000000.86826
Palladium (Pd)7440-05-30.028002.000000.01790
subTotal1.40000100.000000.89511
WirePure metalGold (Au)7440-57-50.1976999.000000.12639
Palladium (Pd)7440-05-30.002001.000000.00128
subTotal0.19968100.000000.12767
total156.40515100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.