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Chemical content 74HC594DB

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Type numberPackagePackage descriptionTotal product weight
74HC594DBSOT338-1SSOP16127.33069 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351901601182212601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China; Shanghai, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-47.5000075.000005.89017
PolymerResin systemProprietary2.5000025.000001.96339
subTotal10.00000100.000007.85356
DieDoped siliconSilicon (Si)7440-21-30.80456100.000000.63186
subTotal0.80456100.000000.63186
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.8772697.4700037.60073
Iron (Fe)7439-89-61.178882.400000.92584
Phosphorus (P)7723-14-00.014740.030000.01157
Zinc (Zn)7440-66-60.049120.100000.03858
subTotal49.12000100.0000038.57672
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-750.2500075.0000039.46417
Flame retardantAntimony Trioxide (Sb2O3)1309-64-41.474002.200001.15762
Misc. Bromine compounds (generic)Proprietary1.072001.600000.84190
PolymerEpoxy resin systemProprietary14.2040021.2000011.15521
subTotal67.00000100.0000052.61890
Pre-PlatingPure metal layerGold (Au)7440-57-50.002001.000000.00157
Nickel (Ni)7440-02-00.1940097.000000.15236
Palladium (Pd)7440-05-30.004002.000000.00314
subTotal0.20000100.000000.15707
WirePure metalGold (Au)7440-57-50.2040799.000000.16027
Palladium (Pd)7440-05-30.002061.000000.00162
subTotal0.20613100.000000.16189
total127.33069100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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