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Chemical content 74HC595DB

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Type numberPackagePackage descriptionTotal product weight
74HC595DBSOT338-1SSOP16127.07645 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351652101182512601235Suzhou, China; Bangkok, Thailand; Shanghai, China; Nijmegen, Netherlands; Jiangyin, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-47.5000075.000005.90196
PolymerResin systemProprietary2.5000025.000001.96732
subTotal10.00000100.000007.86928
DieDoped siliconSilicon (Si)7440-21-30.54516100.000000.42900
subTotal0.54516100.000000.42900
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.8772697.4700037.67595
Iron (Fe)7439-89-61.178882.400000.92769
Phosphorus (P)7723-14-00.014740.030000.01160
Zinc (Zn)7440-66-60.049120.100000.03865
subTotal49.12000100.0000038.65389
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-750.2500075.0000039.54313
Flame retardantAntimony Trioxide (Sb2O3)1309-64-41.474002.200001.15993
Misc. Bromine compounds (generic)Proprietary1.072001.600000.84359
PolymerEpoxy resin systemProprietary14.2040021.2000011.17752
subTotal67.00000100.0000052.72417
Pre-PlatingPure metal layerGold (Au)7440-57-50.002001.000000.00157
Nickel (Ni)7440-02-00.1940097.000000.15266
Palladium (Pd)7440-05-30.004002.000000.00315
subTotal0.20000100.000000.15738
WirePure metalGold (Au)7440-57-50.2091799.000000.16460
Palladium (Pd)7440-05-30.002111.000000.00166
subTotal0.21129100.000000.16626
total127.07645100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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