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Chemical content 74HCT08BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT08BQ-Q100SOT762-1DHVQFN1418.16840 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298752115612601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10255
PolymerResin systemProprietary0.0046319.900000.02548
subTotal0.02326100.000000.12803
DieDoped siliconSilicon (Si)7440-21-30.19236100.000001.05879
subTotal0.19236100.000001.05879
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.12330
Iron (Fe)7439-89-60.166072.400000.91409
Phosphorus (P)7723-14-00.002080.030000.01143
Zinc (Zn)7440-66-60.006920.100000.03809
subTotal6.91978100.0000038.08691
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68497
FillerSilica -amorphous-7631-86-90.367153.490002.02081
Silica fused60676-86-08.9230784.8200049.11314
PigmentCarbon black1333-86-40.016830.160000.09264
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62535
Epoxy resin systemProprietary0.167271.590000.92065
Phenolic resinProprietary0.236702.250001.30281
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14240
subTotal10.52001100.0000057.90277
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07619
Nickel (Ni)7440-02-00.4258792.300002.34403
Palladium (Pd)7440-05-30.014303.100000.07873
Silver (Ag)7440-22-40.007381.600000.04063
subTotal0.46140100.000002.53958
WirePure metalCopper (Cu)7440-50-80.0498096.550000.27411
Pure metal layerGold (Au)7440-57-50.000180.350000.00099
Palladium (Pd)7440-05-30.001603.100000.00880
subTotal0.05158100.000000.28390
total18.16840100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.