Chemical content 74HCT4094DB

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Type number	Package	Package description	Total product weight
74HCT4094DB	SOT338-1	SSOP16	127.15542 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
935190050118	25	1	260		1	235			Shanghai, China; Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silver (Ag)	7440-22-4	7.50000	75.00000	5.89829
	Polymer	Resin system	Proprietary	2.50000	25.00000	1.96610
		subTotal		10.00000	100.00000	7.86439

Die	Doped silicon	Silicon (Si)	7440-21-3	0.62922	100.00000	0.49485
		subTotal		0.62922	100.00000	0.49485

Lead Frame Material	Copper alloy	Copper (Cu)	7440-50-8	47.87726	97.47000	37.65255
		Iron (Fe)	7439-89-6	1.17888	2.40000	0.92712
		Phosphorus (P)	7723-14-0	0.01474	0.03000	0.01159
		Zinc (Zn)	7440-66-6	0.04912	0.10000	0.03863
		subTotal		49.12000	100.00000	38.62989

Mould Compound	Filler	Misc. Silica compounds (generic)	14808-60-7	50.25000	75.00000	39.51857
	Flame retardant	Antimony Trioxide (Sb2O3)	1309-64-4	1.47400	2.20000	1.15921
		Misc. Bromine compounds (generic)	Proprietary	1.07200	1.60000	0.84306
	Polymer	Epoxy resin system	Proprietary	14.20400	21.20000	11.17058
		subTotal		67.00000	100.00000	52.69142

Pre-Plating	Pure metal layer	Gold (Au)	7440-57-5	0.00200	1.00000	0.00157
		Nickel (Ni)	7440-02-0	0.19400	97.00000	0.15257
		Palladium (Pd)	7440-05-3	0.00400	2.00000	0.00315
		subTotal		0.20000	100.00000	0.15729

Wire	Pure metal	Gold (Au)	7440-57-5	0.20414	99.00000	0.16054
		Palladium (Pd)	7440-05-3	0.00206	1.00000	0.00162
		subTotal		0.20620	100.00000	0.16216

		total		127.15542	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.