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Chemical content 74HCT597DB

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Type numberPackagePackage descriptionTotal product weight
74HCT597DBSOT338-1SSOP16127.99443 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351901801181712601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-47.5000075.000005.85963
PolymerResin systemProprietary2.5000025.000001.95321
subTotal10.00000100.000007.81284
DieDoped siliconSilicon (Si)7440-21-31.49734100.000001.16985
subTotal1.49734100.000001.16985
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.8772697.4700037.40574
Iron (Fe)7439-89-61.178882.400000.92104
Phosphorus (P)7723-14-00.014740.030000.01151
Zinc (Zn)7440-66-60.049120.100000.03838
subTotal49.12000100.0000038.37667
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-750.2500075.0000039.25952
Flame retardantAntimony Trioxide (Sb2O3)1309-64-41.474002.200001.15161
Misc. Bromine compounds (generic)Proprietary1.072001.600000.83754
PolymerEpoxy resin systemProprietary14.2040021.2000011.09736
subTotal67.00000100.0000052.34603
Pre-PlatingPure metal layerGold (Au)7440-57-50.002001.000000.00156
Nickel (Ni)7440-02-00.1940097.000000.15157
Palladium (Pd)7440-05-30.004002.000000.00313
subTotal0.20000100.000000.15626
WirePure metalGold (Au)7440-57-50.1753299.000000.13698
Palladium (Pd)7440-05-30.001771.000000.00138
subTotal0.17709100.000000.13836
total127.99443100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.