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Chemical content 74LV08PW

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Type numberPackagePackage descriptionTotal product weight
74LV08PWSOT402-1TSSOP1452.45883 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351742801181212601235Shanghai, China; Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.05940
PolymerAcrylic resinProprietary0.0060815.200000.01159
Resin systemProprietary0.002766.900000.00526
subTotal0.04000100.000000.07625
DieDoped siliconSilicon (Si)7440-21-30.83243100.000001.58682
subTotal0.83243100.000001.58682
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.30588
Iron (Fe)7439-89-60.468962.400000.89396
Phosphorus (P)7723-14-00.005860.030000.01117
Zinc (Zn)7440-66-60.019540.100000.03725
subTotal19.54000100.0000037.24826
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.83834
FillerSilica fused60676-86-025.0272079.0000047.70827
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.62341
PigmentCarbon black1333-86-40.063360.200000.12078
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.41561
Non hazardousProprietary1.298884.100002.47600
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.20780
subTotal31.68000100.0000060.39021
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00553
Nickel (Ni)7440-02-00.2813097.000000.53623
Palladium (Pd)7440-05-30.005802.000000.01106
subTotal0.29000100.000000.55282
WirePure metalCopper (Cu)7440-50-80.07641100.000000.14565
subTotal0.07641100.000000.14565
total52.45883100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.