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Chemical content 74LV14DB

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Type numberPackagePackage descriptionTotal product weight
74LV14DBSOT337-1SSOP14104.05552 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351701801181912601235Suzhou, China; Bangkok, Thailand; Nijmegen, NetherlandsLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-46.0000075.000005.76615
PolymerResin systemProprietary2.0000025.000001.92205
subTotal8.00000100.000007.68820
DieDoped siliconSilicon (Si)7440-21-30.74496100.000000.71593
subTotal0.74496100.000000.71593
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-828.2663097.4700027.16463
Iron (Fe)7439-89-60.696002.400000.66887
Phosphorus (P)7723-14-00.008700.030000.00836
Zinc (Zn)7440-66-60.029000.100000.02787
subTotal29.00000100.0000027.86973
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-749.5000075.0000047.57076
Flame retardantAntimony Trioxide (Sb2O3)1309-64-41.452002.200001.39541
Misc. Bromine compounds (generic)Proprietary1.056001.600001.01484
PolymerEpoxy resin systemProprietary13.9920021.2000013.44667
subTotal66.00000100.0000063.42768
Pre-PlatingPure metal layerGold (Au)7440-57-50.001801.000000.00173
Nickel (Ni)7440-02-00.1746097.000000.16780
Palladium (Pd)7440-05-30.003602.000000.00346
subTotal0.18000100.000000.17299
WirePure metalGold (Au)7440-57-50.1292599.000000.12421
Palladium (Pd)7440-05-30.001311.000000.00125
subTotal0.13055100.000000.12546
total104.05552100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.