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Chemical content 74LV1T00GX

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Type numberPackagePackage descriptionTotal product weight
74LV1T00GXSOT1226-3X2SON50.60973 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690115125712601235Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02706100.000004.43775
subTotal0.02706100.000004.43775
ComponentAdditiveNon hazardousProprietary0.000205.000000.03280
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03280
Silica -amorphous-7631-86-90.0020050.000000.32801
PolymerEpoxy resin systemProprietary0.0012030.000000.19681
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06560
subTotal0.00400100.000000.65602
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100039.21577
Magnesium (Mg)7439-95-40.000380.150000.06224
Nickel (Ni)7440-02-00.007462.950001.22407
Silicon (Si)7440-21-30.001620.640000.26556
Pure metal layerGold (Au)7440-57-50.000050.020000.00830
Nickel (Ni)7440-02-00.004151.640000.68050
Palladium (Pd)7440-05-30.000230.090000.03734
subTotal0.25300100.0000041.49378
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.20980
FillerSilica -amorphous-7631-86-90.000900.290000.14839
Silica fused60676-86-00.2687986.1500044.08312
HardenerPhenolic resinProprietary0.013384.290002.19520
PigmentCarbon black1333-86-40.000590.190000.09722
PolymerEpoxy resin systemProprietary0.027058.670004.43646
subTotal0.31200100.0000051.17019
WireGold alloyGold (Au)7440-57-50.0135499.000002.22042
Palladium (Pd)7440-05-30.000141.000000.02243
subTotal0.01368100.000002.24285
total0.60973100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.