×

Chemical content 74LVC10ABQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC10ABQSOT762-1DHVQFN1421.77838 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352735921151912601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43400
PolymerResin systemProprietary0.0234819.900000.10782
subTotal0.11800100.000000.54182
DieDoped siliconSilicon (Si)7440-21-30.16199100.000000.74383
subTotal0.16199100.000000.74383
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.69288
Iron (Fe)7439-89-60.205522.346100.94368
Phosphorus (P)7723-14-00.002650.030200.01215
Zinc (Zn)7440-66-60.008890.101500.04083
Pure metal layerGold (Au)7440-57-50.002650.030200.01215
Nickel (Ni)7440-02-00.106921.220500.49093
Palladium (Pd)7440-05-30.004910.056000.02253
Silver (Ag)7440-22-40.001800.020500.00825
subTotal8.76000100.0000040.22340
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.69509
FillerSilica -amorphous-7631-86-90.442743.490002.03294
Silica fused60676-86-010.7602784.8200049.40801
PigmentCarbon black1333-86-40.020300.160000.09320
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62910
Epoxy resin systemProprietary0.201711.590000.92618
Phenolic resinProprietary0.285442.250001.31063
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.15527
subTotal12.68600100.0000058.25042
WirePure metalCopper (Cu)7440-50-80.0505896.550000.23224
Pure metal layerGold (Au)7440-57-50.000180.350000.00084
Palladium (Pd)7440-05-30.001623.100000.00746
subTotal0.05239100.000000.24054
total21.77838100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.