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Chemical content 74LVC11D-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC11D-Q100SOT108-1SO14141.59428 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690357118712601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01650
PolymerAcrylic resinProprietary0.0045615.200000.00322
Resin systemProprietary0.002076.900000.00146
subTotal0.03000100.000000.02118
DieDoped siliconSilicon (Si)7440-21-30.16199100.000000.11441
subTotal0.16199100.000000.11441
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.72173
Iron (Fe)7439-89-61.175702.400000.83033
Phosphorus (P)7723-14-00.014700.030000.01038
Zinc (Zn)7440-66-60.048990.100000.03460
subTotal48.98742100.0000034.59704
Mould CompoundAdditiveNon hazardousProprietary4.280974.700003.02341
FillerSilica fused60676-86-071.9567679.0000050.81897
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.465076.000003.85967
PigmentCarbon black1333-86-40.182170.200000.12866
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.643384.000002.57311
Non hazardousProprietary3.734464.100002.63744
Tetramethylbiphenyl diglycidyl ether85954-11-61.821692.000001.28656
subTotal91.08450100.0000064.32782
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02635
Nickel (Ni)7440-02-01.1477892.300000.81061
Palladium (Pd)7440-05-30.038553.100000.02723
Silver (Ag)7440-22-40.019901.600000.01405
subTotal1.24353100.000000.87824
WirePure metalCopper (Cu)7440-50-80.08683100.000000.06133
subTotal0.08683100.000000.06133
total141.59428100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.