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Chemical content 74LVC1G123DC

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Type numberPackagePackage descriptionTotal product weight
74LVC1G123DCSOT765-1VSSOP89.98752 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352956651251212601235Bangkok, Thailand; Ayutthaya, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28744
PolymerResin systemProprietary0.0071319.900000.07141
subTotal0.03584100.000000.35885
DieDoped siliconSilicon (Si)7440-21-30.13644100.000001.36615
subTotal0.13644100.000001.36615
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000034.02797
Nickel (Ni)7440-02-00.105113.000001.05241
subTotal3.50366100.0000035.08038
Mould CompoundAdditiveNon hazardousProprietary0.290574.700002.90931
FillerSilica fused60676-86-04.8840279.0000048.90120
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.370946.000003.71402
PigmentCarbon black1333-86-40.012360.200000.12380
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.247294.000002.47601
Non hazardousProprietary0.253474.100002.53791
Tetramethylbiphenyl diglycidyl ether85954-11-60.123652.000001.23801
subTotal6.18230100.0000061.90026
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03092
Nickel (Ni)7440-02-00.0950292.300000.95142
Palladium (Pd)7440-05-30.003193.100000.03195
Silver (Ag)7440-22-40.001651.600000.01649
subTotal0.10295100.000001.03078
WirePure metalCopper (Cu)7440-50-80.02632100.000000.26358
subTotal0.02632100.000000.26358
total9.98752100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.