Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC1G125GF

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Type numberPackagePackage descriptionTotal product weight
74LVC1G125GFSOT891XSON61.20522 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528240913222126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06089100.000005.05233
subTotal0.06089100.000005.05233
ComponentAdditiveNon hazardousProprietary0.001505.000000.12446
FillerAluminium Trioxide (Al2O3)1344-28-10.0120040.000000.99567
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0045015.000000.37338
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0030010.000000.24892
Resin systemProprietary0.0090030.000000.74675
subTotal0.03000100.000002.48918
Lead FrameCopper alloyCopper (Cu)7440-50-80.4670093.4000038.74811
Magnesium (Mg)7439-95-40.000750.150000.06223
Nickel (Ni)7440-02-00.014552.910001.20725
Silicon (Si)7440-21-30.003150.630000.26136
Pure metal layerGold (Au)7440-57-50.000200.040000.01659
Nickel (Ni)7440-02-00.013802.760001.14502
Palladium (Pd)7440-05-30.000550.110000.04563
subTotal0.50000100.0000041.48619
Mould CompoundFillerSilica -amorphous-7631-86-90.1160020.000009.62480
Silica fused60676-86-00.3741064.5000031.03998
Flame retardantMetal hydroxideProprietary0.017403.000001.44372
ImpuritySilicon Dioxide (SiO2)14808-60-70.002900.500000.24062
PigmentCarbon black1333-86-40.001740.300000.14437
PolymerPhenol Formaldehyde resin (generic)9003-35-40.012762.200001.05873
Phenolic resinProprietary0.014502.500001.20310
Tetramethylbiphenyl diglycidyl ether85954-11-60.040607.000003.36868
subTotal0.58000100.0000048.12400
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0200099.990001.65928
subTotal0.02000100.000001.65945
WireGold alloyGold (Au)7440-57-50.0141999.000001.17731
Palladium (Pd)7440-05-30.000141.000000.01189
subTotal0.01433100.000001.18920
total1.20522100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.