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Chemical content 74LVC1G332GV-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G332GV-Q100SOT457SC-7410.62174 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935304365125512601235Seremban, Malaysia; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0150075.000000.14122
PolymerResin systemProprietary0.0050025.000000.04707
subTotal0.02000100.000000.18829
DieDoped siliconSilicon (Si)7440-21-30.07260100.000000.68353
subTotal0.07260100.000000.68353
Lead FrameCopper alloyCopper (Cu)7440-50-83.3491597.0768031.53108
Iron (Fe)7439-89-60.074182.150000.69833
Phosphorus (P)7723-14-00.000520.015200.00494
Zinc (Zn)7440-66-60.002000.058000.01884
Pure metal layerSilver (Ag)7440-22-40.024150.700000.22736
subTotal3.45000100.0000032.48055
Mould CompoundFillerSilica fused60676-86-04.6292071.0000043.58231
PigmentCarbon black1333-86-40.019560.300000.18415
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2844419.7000012.09256
Phenolic resinProprietary0.586809.000005.52452
subTotal6.52000100.0000061.38354
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.003000.00015
Bismuth (Bi)7440-69-90.000010.001000.00005
Copper (Cu)7440-50-80.000010.001000.00005
Lead (Pb)7439-92-10.000030.005000.00024
Tin solderTin (Sn)7440-31-50.5199599.990004.89513
subTotal0.52000100.000004.89562
WireGold alloyGold (Au)7440-57-50.0387499.000000.36476
Palladium (Pd)7440-05-30.000391.000000.00368
subTotal0.03914100.000000.36844
total10.62174100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.