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Chemical content 74LVC1G86GS

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Type numberPackagePackage descriptionTotal product weight
74LVC1G86GSSOT1202X2SON60.96139 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292922132612601235Seremban, Malaysia; Shanghai, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03045100.000003.16685
subTotal0.03045100.000003.16685
ComponentAdditiveNon hazardousProprietary0.000255.000000.02600
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02600
Silica -amorphous-7631-86-90.0025050.000000.26004
PolymerEpoxy resin systemProprietary0.0015030.000000.15602
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05201
subTotal0.00500100.000000.52007
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100041.38665
Magnesium (Mg)7439-95-40.000630.150000.06569
Nickel (Ni)7440-02-00.012422.950001.29183
Silicon (Si)7440-21-30.002690.640000.28026
Pure metal layerGold (Au)7440-57-50.000080.020000.00876
Nickel (Ni)7440-02-00.006901.640000.71817
Palladium (Pd)7440-05-30.000380.090000.03941
subTotal0.42100100.0000043.79077
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20939
FillerSilica -amorphous-7631-86-90.001420.290000.14811
Silica fused60676-86-00.4230086.1500043.99843
HardenerPhenolic resinProprietary0.021064.290002.19098
PigmentCarbon black1333-86-40.000930.190000.09704
PolymerEpoxy resin systemProprietary0.042578.670004.42793
subTotal0.49100100.0000051.07188
WireGold alloyGold (Au)7440-57-50.0138099.000001.43548
Palladium (Pd)7440-05-30.000141.000000.01450
subTotal0.01394100.000001.44998
total0.96139100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.