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Chemical content 74LVC1G98GS

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Type numberPackagePackage descriptionTotal product weight
74LVC1G98GSSOT1202X2SON60.96621 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935293195132512601235Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03355100.000003.47254
subTotal0.03355100.000003.47254
ComponentAdditiveNon hazardousProprietary0.000255.000000.02587
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02587
Silica -amorphous-7631-86-90.0025050.000000.25874
PolymerEpoxy resin systemProprietary0.0015030.000000.15525
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05175
subTotal0.00500100.000000.51748
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100041.18019
Magnesium (Mg)7439-95-40.000630.150000.06536
Nickel (Ni)7440-02-00.012422.950001.28538
Silicon (Si)7440-21-30.002690.640000.27886
Pure metal layerGold (Au)7440-57-50.000080.020000.00871
Nickel (Ni)7440-02-00.006901.640000.71459
Palladium (Pd)7440-05-30.000380.090000.03922
subTotal0.42100100.0000043.57231
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20835
FillerSilica -amorphous-7631-86-90.001420.290000.14737
Silica fused60676-86-00.4230086.1500043.77894
HardenerPhenolic resinProprietary0.021064.290002.18005
PigmentCarbon black1333-86-40.000930.190000.09655
PolymerEpoxy resin systemProprietary0.042578.670004.40584
subTotal0.49100100.0000050.81710
WireGold alloyGold (Au)7440-57-50.0155099.000001.60405
Palladium (Pd)7440-05-30.000161.000000.01620
subTotal0.01566100.000001.62025
total0.96621100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.