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Chemical content 74LVC2G00GM

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Type numberPackagePackage descriptionTotal product weight
74LVC2G00GMSOT902-2XQFN8(U)3.40317 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352772351251512601235Suzhou, China; Bangkok, Thailand; Seremban, Malaysia; Ayutthaya, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.010005.000000.29384
FillerAluminium Trioxide (Al2O3)1344-28-10.0800040.000002.35075
PolymerBisphenol A-epichlorohydrin resin25068-38-60.0200010.000000.58769
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0300015.000000.88153
Resin systemProprietary0.0600030.000001.76306
subTotal0.20000100.000005.87687
DieDoped siliconSilicon (Si)7440-21-30.11092100.000003.25925
subTotal0.11092100.000003.25925
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-81.5520097.0000045.60454
Nickel (Ni)7440-02-00.048003.000001.41045
subTotal1.60000100.0000047.01499
Mould CompoundFillerSilica -amorphous-7631-86-90.105007.500003.08536
Silica fused60676-86-01.0871077.6500031.94375
Flame retardantNon hazardousProprietary0.077005.500002.26260
HardenerPhenolic resinProprietary0.049003.500001.43983
PigmentCarbon black1333-86-40.001400.100000.04114
PolymerEpoxy resin systemProprietary0.080505.750002.36544
subTotal1.40000100.0000041.13812
Pre-PlatingPure metal layerGold (Au)7440-57-50.000501.000000.01469
Nickel (Ni)7440-02-00.0485097.000001.42514
Palladium (Pd)7440-05-30.001002.000000.02938
subTotal0.05000100.000001.46921
WirePure metalGold (Au)7440-57-50.0418399.000001.22922
Palladium (Pd)7440-05-30.000421.000000.01242
subTotal0.04226100.000001.24164
total3.40317100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.