Chemical content 74LVC2G32GF

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type number	Package	Package description	Total product weight
74LVC2G32GF	SOT1089	XSON8	1.80224 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
935291507115	4	1	260	30 s	1	240	20 s	3	Nijmegen, Netherlands; Seremban, Malaysia; Ayutthaya, Thailand; Bangkok, Thailand; Suzhou, China

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	0.11092	100.00000	6.15443
		subTotal		0.11092	100.00000	6.15443

Component	Additive	Non hazardous	Proprietary	0.00100	5.00000	0.05549
	Filler	Aluminium Trioxide (Al2O3)	1344-28-1	0.00800	40.00000	0.44389
	Polymer	Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer	25036-25-3	0.00300	15.00000	0.16646
		Bisphenol-A/Epichlorohydrin Epoxy resin (generic)	25068-38-6	0.00200	10.00000	0.11097
		Resin system	Proprietary	0.00600	30.00000	0.33292
		subTotal		0.02000	100.00000	1.10973

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	0.63724	95.11000	35.35805
		Magnesium (Mg)	7439-95-4	0.00134	0.20000	0.07435
		Nickel (Ni) - cas no. 7440-02-0	7440-02-0	0.02124	3.17000	1.17848
		Silicon (Si)	7440-21-3	0.00462	0.69000	0.25651
	Pure metal layer	Gold (Au)	7440-57-5	0.00013	0.02000	0.00744
		Nickel (Ni) - cas no. 7440-02-0	7440-02-0	0.00496	0.74000	0.27510
		Palladium (Pd)	7440-05-3	0.00047	0.07000	0.02602
		subTotal		0.67000	100.00000	37.17595

Mould Compound	Filler	Silica -amorphous-	7631-86-9	0.18800	20.00000	10.43146
		Silica fused	60676-86-0	0.60630	64.50000	33.64147
	Flame retardant	Metal hydroxide	Proprietary	0.02820	3.00000	1.56472
	Impurity	Silicon Dioxide (SiO2)	14808-60-7	0.00470	0.50000	0.26079
	Pigment	Carbon black	1333-86-4	0.00282	0.30000	0.15647
	Polymer	Phenol Formaldehyde resin (generic)	9003-35-4	0.02068	2.20000	1.14746
		Phenolic resin	Proprietary	0.02350	2.50000	1.30393
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	0.06580	7.00000	3.65101
		subTotal		0.94000	100.00000	52.15731

Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.00000	0.00300	0.00005
		Bismuth (Bi)	7440-69-9	0.00000	0.00100	0.00002
		Copper (Cu)	7440-50-8	0.00000	0.00100	0.00002
		Lead (Pb)	7439-92-1	0.00000	0.00500	0.00008
	Tin solder	Tin (Sn)	7440-31-5	0.03000	99.99000	1.66443
		subTotal		0.03000	100.00000	1.66460

Wire	Gold alloy	Gold (Au)	7440-57-5	0.03101	99.00000	1.72073
		Palladium (Pd)	7440-05-3	0.00031	1.00000	0.01738
		subTotal		0.03132	100.00000	1.73811

		total		1.80224	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

China RoHS Information

Name of the part 部件名称	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
Die 晶粒	O	O	O	O	O	O
Component 元器件	O	O	O	O	O	O
Lead Frame 引线框	O	O	O	O	O	O
Mould Compound 注塑胶料	O	O	O	O	O	O
Post-Plating 后电镀	O	O	O	O	O	O
Wire 线	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

Remark: All Nexperia products have an environmental friendly use period (EFUP) of 50 years.

disclaimer 免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

disclaimer
免责声明

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.