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Chemical content 74LVC2T45DC-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC2T45DC-Q100SOT765-1VSSOP89.97576 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300461125712601235Ayutthaya, Thailand; Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28778
PolymerResin systemProprietary0.0071319.900000.07149
subTotal0.03584100.000000.35927
DieDoped siliconSilicon (Si)7440-21-30.12058100.000001.20870
subTotal0.12058100.000001.20870
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000034.06808
Nickel (Ni)7440-02-00.105113.000001.05365
subTotal3.50366100.0000035.12173
Mould CompoundAdditiveNon hazardousProprietary0.290574.700002.91274
FillerSilica fused60676-86-04.8840279.0000048.95885
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.370946.000003.71839
PigmentCarbon black1333-86-40.012360.200000.12395
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.247294.000002.47893
Non hazardousProprietary0.253474.100002.54090
Tetramethylbiphenyl diglycidyl ether85954-11-60.123652.000001.23946
subTotal6.18230100.0000061.97322
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03096
Nickel (Ni)7440-02-00.0950292.300000.95254
Palladium (Pd)7440-05-30.003193.100000.03199
Silver (Ag)7440-22-40.001651.600000.01651
subTotal0.10295100.000001.03200
WirePure metalCopper (Cu)7440-50-80.03043100.000000.30503
subTotal0.03043100.000000.30503
total9.97576100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.