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Chemical content 74LVCH8T245BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVCH8T245BQ-Q100SOT815-1DHVQFN2450.78631 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301103118512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1018880.100000.20060
PolymerResin systemProprietary0.0253119.900000.04984
subTotal0.12719100.000000.25044
DieDoped siliconSilicon (Si)7440-21-30.95361100.000001.87770
subTotal0.95361100.000001.87770
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0780897.4700037.56539
Iron (Fe)7439-89-60.469762.400000.92497
Phosphorus (P)7723-14-00.005870.030000.01156
Zinc (Zn)7440-66-60.019570.100000.03854
subTotal19.57328100.0000038.54046
Mould CompoundAdditiveNon hazardousProprietary0.858522.910001.69046
FillerSilica -amorphous-7631-86-91.029633.490002.02739
Silica fused60676-86-025.0239484.8200049.27301
PigmentCarbon black1333-86-40.047200.160000.09295
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.318631.080000.62739
Epoxy resin systemProprietary0.469091.590000.92365
Phenolic resinProprietary0.663802.250001.30705
Tetramethylbiphenyl diglycidyl ether85954-11-61.091593.700002.14938
subTotal29.50241100.0000058.09128
Pre-PlatingPure metal layerGold (Au)7440-57-50.004971.000000.00978
Nickel (Ni)7440-02-00.4521491.000000.89028
Palladium (Pd)7440-05-30.039758.000000.07827
subTotal0.49686100.000000.97833
WirePure metalCopper (Cu)7440-50-80.1283796.550000.25277
Pure metal layerGold (Au)7440-57-50.000470.350000.00092
Palladium (Pd)7440-05-30.004123.100000.00812
subTotal0.13296100.000000.26181
total50.78631100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.