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Chemical content BAS21AW-Q

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Type numberPackagePackage descriptionTotal product weight
BAS21AW-QSOT323SC-705.53589 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664822115112601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.12000100.000002.16767
subTotal0.12000100.000002.16767
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001620.090000.02926
Carbon (C)7440-44-00.000720.040000.01301
Chromium (Cr)7440-47-30.003780.210000.06828
Cobalt (Co)7440-48-40.007560.420000.13656
Iron (Fe)7439-89-60.8490647.1700015.33737
Manganese (Mn)7439-96-50.015300.850000.27638
Nickel (Ni)7440-02-00.6397235.5400011.55587
Phosphorus (P)7723-14-00.000360.020000.00650
Silicon (Si)7440-21-30.004500.250000.08129
Sulphur (S)7704-34-90.000360.020000.00650
Pure metal layerCopper (Cu)7440-50-80.2349013.050004.24322
Silver (Ag)7440-22-40.042122.340000.76085
subTotal1.80000100.0000032.51509
Mould CompoundFillerSilica fused60676-86-02.5534075.1000046.12447
PigmentCarbon black1333-86-40.010200.300000.18425
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5950017.5000010.74805
Phenol Formaldehyde resin (generic)9003-35-40.241407.100004.36064
subTotal3.40000100.0000061.41741
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00011
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Tin solderTin (Sn)7440-31-50.2099899.990003.79305
subTotal0.21000100.000003.79343
WirePure metalCopper (Cu)7440-50-80.00589100.000000.10632
subTotal0.00589100.000000.10632
total5.53589100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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