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Chemical content BAS70XY-Q

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Type numberPackagePackage descriptionTotal product weight
BAS70XY-QSOT363SC-885.66155 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664526115312601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.08000100.000001.41304
subTotal0.08000100.000001.41304
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002050.090000.03624
Carbon (C)7440-44-00.000910.040000.01611
Chromium (Cr)7440-47-30.004790.210000.08457
Cobalt (Co)7440-48-40.009800.430000.17317
Iron (Fe)7439-89-61.0807247.4000019.08877
Manganese (Mn)7439-96-50.019380.850000.34231
Nickel (Ni)7440-02-00.8144235.7200014.38504
Phosphorus (P)7723-14-00.000460.020000.00805
Silicon (Si)7440-21-30.005930.260000.10471
Sulphur (S)7704-34-90.000460.020000.00805
Pure metal layerCopper (Cu)7440-50-80.2989113.110005.27961
Silver (Ag)7440-22-40.042181.850000.74503
subTotal2.28000100.0000040.27166
Mould CompoundFillerSilica fused60676-86-02.1929275.1000038.73356
PigmentCarbon black1333-86-40.008760.300000.15473
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5110017.500009.02580
Phenol Formaldehyde resin (generic)9003-35-40.207327.100003.66189
subTotal2.92000100.0000051.57598
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00033
Tin solderTin (Sn)7440-31-50.3699699.990006.53466
subTotal0.37000100.000006.53533
WirePure metalCopper (Cu)7440-50-80.01155100.000000.20396
subTotal0.01155100.000000.20396
total5.66155100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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