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Chemical content BAT854W

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAT854WSOT323SC-705.46309 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340561761151212601235D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05000100.000000.91523
subTotal0.05000100.000000.91523
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001620.090000.02965
Carbon (C)7440-44-00.000720.040000.01318
Chromium (Cr)7440-47-30.003780.210000.06919
Cobalt (Co)7440-48-40.007560.420000.13838
Iron (Fe)7439-89-60.8490647.1700015.54175
Manganese (Mn)7439-96-50.015300.850000.28006
Nickel (Ni)7440-02-00.6397235.5400011.70986
Phosphorus (P)7723-14-00.000360.020000.00659
Silicon (Si)7440-21-30.004500.250000.08237
Sulphur (S)7704-34-90.000360.020000.00659
Pure metal layerCopper (Cu)7440-50-80.2349013.050004.29976
Silver (Ag)7440-22-40.042122.340000.77099
subTotal1.80000100.0000032.94837
Mould CompoundFillerSilica fused60676-86-02.5534075.1000046.73912
PigmentCarbon black1333-86-40.010200.300000.18671
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5950017.5000010.89127
Phenol Formaldehyde resin (generic)9003-35-40.241407.100004.41874
subTotal3.40000100.0000062.23584
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00012
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Tin solderTin (Sn)7440-31-50.2099899.990003.84359
subTotal0.21000100.000003.84398
WirePure metalCopper (Cu)7440-50-80.00309100.000000.05659
subTotal0.00309100.000000.05659
total5.46309100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.