×

Chemical content BC850C

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC850CSOT23TO-236AB7.66060 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9335897002351812601235Dongguan, China; D-22529 HAMBURG, Germany; Suqian, China; Seremban, Malaysia 
9335897002151612601235Suqian, China; Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04000100.000000.52215
subTotal0.04000100.000000.52215
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02995
Carbon (C)7440-44-00.001020.040000.01331
Chromium (Cr)7440-47-30.005610.220000.07320
Cobalt (Co)7440-48-40.010960.430000.14308
Iron (Fe)7439-89-61.2230147.9800015.96494
Manganese (Mn)7439-96-50.021920.860000.28616
Nickel (Ni)7440-02-00.9212136.1400012.02528
Phosphorus (P)7723-14-00.000510.020000.00665
Silicon (Si)7440-21-30.006630.260000.08651
Sulphur (S)7704-34-90.000510.020000.00665
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.78327
Silver (Ag)7440-22-40.065512.570000.85515
subTotal2.54900100.0000033.27415
Mould CompoundAdditiveNon hazardousProprietary0.141492.900001.84700
Triphenylphosphine603-35-00.002440.050000.03184
FillerSilica -amorphous-7631-86-93.5128872.0000045.85646
PigmentCarbon black1333-86-40.002440.050000.03184
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7318515.000009.55343
Phenol Formaldehyde resin (generic)9003-35-40.4879010.000006.36895
subTotal4.87900100.0000063.68952
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000100.055500.00134
Tin solderTin (Sn)7440-31-50.1848999.940002.41351
subTotal0.18500100.000002.41496
WirePure metalCopper (Cu)7440-50-80.00760100.000000.09920
subTotal0.00760100.000000.09920
total7.66060100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.