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Chemical content BC856AQC-Q

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Type numberPackagePackage descriptionTotal product weight
BC856AQC-QSOT8009DFN1412D-32.41995 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664268147112601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0106476.000000.43968
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0014710.470000.06057
Phenolic resinProprietary0.0018913.530000.07827
subTotal0.01400100.000000.57852
DieDoped siliconSilicon (Si)7440-21-30.03000100.000001.23970
subTotal0.03000100.000001.23970
Lead FrameCopper alloyCopper (Cu)7440-50-81.0895093.2792045.02163
Magnesium (Mg)7439-95-40.001700.145400.07018
Nickel (Ni)7440-02-00.033982.908901.40399
Silicon (Si)7440-21-30.007360.630300.30422
Pure metal layerGold (Au)7440-57-50.000440.037300.01800
Nickel (Ni)7440-02-00.033552.872201.38628
Palladium (Pd)7440-05-30.001480.126700.06115
subTotal1.16800100.0000048.26545
Mould CompoundFillerSilica -amorphous-7631-86-90.088747.980003.66692
Silica fused60676-86-00.8906280.0920036.80337
PigmentCarbon black1333-86-40.010320.928000.42643
PolymerEpoxy resin systemProprietary0.093968.450003.88289
Phenolic resinProprietary0.028362.550001.17176
subTotal1.11200100.0000045.95137
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000050.055500.00190
Tin solderTin (Sn)7440-31-50.0829599.940003.42777
subTotal0.08300100.000003.42982
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalCopper (Cu)7440-50-80.0129599.990000.53508
subTotal0.01295100.000000.53513
total2.41995100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.