Chemical content BC856AQC-Q

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Type numberPackagePackage descriptionTotal product weight
BC856AQC-QSOT8009DFN1412D-32.41070 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346642681471126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0106476.000000.44137
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0014710.470000.06080
Phenolic resinProprietary0.0018913.530000.07857
DieDoped siliconSilicon (Si)7440-21-30.03000100.000001.24445
Lead FrameCopper alloyCopper (Cu)7440-50-81.0895093.2792045.19439
Magnesium (Mg)7439-95-40.001700.145400.07045
Nickel (Ni)7440-02-00.033982.908901.40938
Silicon (Si)7440-21-30.007360.630300.30538
Pure metal layerGold (Au)7440-57-50.000440.037300.01807
Nickel (Ni)7440-02-00.033552.872201.39160
Palladium (Pd)7440-05-30.001480.126700.06139
Mould CompoundFillerSilica -amorphous-7631-86-90.088747.980003.68099
Silica fused60676-86-00.8906280.0920036.94458
PigmentCarbon black1333-86-40.010320.928000.42806
PolymerEpoxy resin systemProprietary0.093968.450003.89779
Phenolic resinProprietary0.028362.550001.17626
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000050.055500.00191
Tin solderTin (Sn)7440-31-50.0829599.940003.44092
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0037099.990000.15347
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.