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Chemical content BFS19

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Type numberPackagePackage descriptionTotal product weight
BFS19SOT23TO-236AB7.65986 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9330835012351512601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
9330835012151312601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06000100.000000.78330
subTotal0.06000100.000000.78330
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02995
Carbon (C)7440-44-00.001020.040000.01331
Chromium (Cr)7440-47-30.005610.220000.07321
Cobalt (Co)7440-48-40.010960.430000.14309
Iron (Fe)7439-89-61.2230147.9800015.96648
Manganese (Mn)7439-96-50.021920.860000.28619
Nickel (Ni)7440-02-00.9212136.1400012.02644
Phosphorus (P)7723-14-00.000510.020000.00666
Silicon (Si)7440-21-30.006630.260000.08652
Sulphur (S)7704-34-90.000510.020000.00666
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.78364
Silver (Ag)7440-22-40.065512.570000.85523
subTotal2.54900100.0000033.27738
Mould CompoundFillerSilica fused60676-86-03.4449271.0000044.97367
PigmentCarbon black1333-86-40.014560.300000.19003
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9558419.7000012.47861
Phenolic resinProprietary0.436689.000005.70089
subTotal4.85200100.0000063.34320
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000100.055500.00134
Tin solderTin (Sn)7440-31-50.1848999.940002.41374
subTotal0.18500100.000002.41519
WirePure metalGold (Au)7440-57-50.01386100.000000.18094
subTotal0.01386100.000000.18094
total7.65986100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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