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Chemical content BSP32

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Type numberPackagePackage descriptionTotal product weight
BSP32SOT223SC-73105.82007 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9339819801151312601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.34000100.000000.32130
subTotal0.34000100.000000.32130
Lead FrameCopper alloyCopper (Cu)7440-50-850.7251499.1500047.93527
Iron (Fe)7439-89-60.051160.100000.04835
Phosphorus (P)7723-14-00.015350.030000.01450
Pure metal layerSilver (Ag)7440-22-40.368350.720000.34809
subTotal51.16000100.0000048.34621
Mould CompoundFillerSilica fused60676-86-037.7862071.0000035.70797
PigmentCarbon black1333-86-40.159660.300000.15088
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-210.4843419.700009.90770
Phenolic resinProprietary4.789809.000004.52636
subTotal53.22000100.0000050.29291
Post-PlatingImpurityLead (Pb)7439-92-10.000050.004500.00004
Non hazardousProprietary0.000570.055500.00053
Tin solderTin (Sn)7440-31-51.0193999.940000.96332
subTotal1.02000100.000000.96389
WirePure metalGold (Au)7440-57-50.08007100.000000.07567
subTotal0.08007100.000000.07567
total105.82007100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.