×

Chemical content BUK9K35-60E/1

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9K35-60E/1SOT1205LFPAK56D80.92000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664088115112601260Cabuyao, Philippines; Dongguan, China; Sherman, United States Of America; Manchester, United Kingdom; Hsin-chu, TaiwanLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.66000100.000002.05141
subTotal1.66000100.000002.05141
ClipCopper alloyCopper (Cu)7440-50-84.9999899.800006.17892
Iron (Fe)7439-89-60.007520.150000.00929
Phosphorus (P)7723-14-00.002500.050000.00310
subTotal5.01000100.000006.19131
Lead FrameCopper alloyCopper (Cu)7440-50-835.3292099.8000043.65942
Iron (Fe)7439-89-60.053100.150000.06562
Phosphorus (P)7723-14-00.017700.050000.02187
subTotal35.40000100.0000043.74691
Mould CompoundAdditiveNon hazardousProprietary0.456401.400000.56401
FillerSilica -amorphous-7631-86-92.053806.300002.53806
Silica fused60676-86-023.4720072.0000029.00643
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.652002.000000.80573
PigmentCarbon black1333-86-40.097800.300000.12086
Polymer2,2'-[[[(oxiranylmethoxy)phenyl]methylene]bis[[(1,1-dimethylethyl)methylphenylene]oxymethylene]]bisoxirane129915-35-11.956006.000002.41720
Bromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.717202.200000.88631
Non hazardousProprietary1.434404.400001.77261
Phenol Formaldehyde resin (generic)9003-35-41.760405.400002.17548
subTotal32.60000100.0000040.28669
Post-PlatingImpurityNon hazardousProprietary0.000190.010000.00024
Tin alloyTin (Sn)7440-31-51.9298199.990002.38483
subTotal1.93000100.000002.38507
Solder PasteLead alloyLead (Pb)7439-92-13.9960092.500004.93821
Silver (Ag)7440-22-40.108002.500000.13347
Tin (Sn)7440-31-50.216005.000000.26693
subTotal4.32000100.000005.33861
total80.92000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.