Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX884S-C5V1

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX884S-C5V1SOD882BDXSON20.88940 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346619223152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.62357
PolymerBisphenol-F/Formaldehyde/Epichlorohydrin copolymer9003-36-50.0019910.470000.22367
Phenolic resinProprietary0.0025713.530000.28904
subTotal0.01900100.000002.13628
DieDoped siliconSilicon (Si)7440-21-30.02800100.000003.14819
subTotal0.02800100.000003.14819
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000042.45784
Magnesium (Mg)7439-95-40.000590.150000.06662
Nickel (Ni) - cas no. 7440-02-07440-02-00.011772.980001.32348
Silicon (Si)7440-21-30.002570.650000.28868
Pure metal layerGold (Au)7440-57-50.000040.010000.00444
Nickel (Ni) - cas no. 7440-02-07440-02-00.002250.570000.25315
Palladium (Pd)7440-05-30.000160.040000.01776
subTotal0.39500100.0000044.41197
Mould CompoundFillerSilica -amorphous-7631-86-90.029617.000003.32921
Silica fused60676-86-00.3510983.0000039.47493
PigmentCarbon black1333-86-40.002120.500000.23780
PolymerEpoxy resin systemProprietary0.025386.000002.85361
Phenolic resinProprietary0.014803.500001.66461
subTotal0.42300100.0000047.56016
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.010000.00022
Bismuth (Bi)7440-69-90.000000.020000.00045
Iron (Fe)7439-89-60.000000.010000.00022
Lead (Pb)7439-92-10.000000.010000.00022
Tin solderTin (Sn)7440-31-50.0199999.950002.24758
subTotal0.02000100.000002.24869
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0044099.990000.49467
subTotal0.00440100.000000.49472
total0.88940100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.