×

Chemical content NHDTC123JT

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NHDTC123JTSOT23TO-236AB7.67356 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661368235112601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
934661368215112601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05400100.000000.70372
subTotal0.05400100.000000.70372
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02990
Carbon (C)7440-44-00.001020.040000.01329
Chromium (Cr)7440-47-30.005610.220000.07308
Cobalt (Co)7440-48-40.010960.430000.14284
Iron (Fe)7439-89-61.2230147.9800015.93798
Manganese (Mn)7439-96-50.021920.860000.28567
Nickel (Ni)7440-02-00.9212136.1400012.00497
Phosphorus (P)7723-14-00.000510.020000.00664
Silicon (Si)7440-21-30.006630.260000.08637
Sulphur (S)7704-34-90.000510.020000.00664
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.77688
Silver (Ag)7440-22-40.065512.570000.85370
subTotal2.54900100.0000033.21796
Mould CompoundAdditiveNon hazardousProprietary0.141492.900001.84388
Triphenylphosphine603-35-00.002440.050000.03179
FillerSilica -amorphous-7631-86-93.5128872.0000045.77901
PigmentCarbon black1333-86-40.002440.050000.03179
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7318515.000009.53729
Phenol Formaldehyde resin (generic)9003-35-40.4879010.000006.35820
subTotal4.87900100.0000063.58196
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00007
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000010.005000.00012
Tin solderTin (Sn)7440-31-50.1849899.990002.41063
subTotal0.18500100.000002.41086
WirePure metalCopper (Cu)7440-50-80.00656100.000000.08544
subTotal0.00656100.000000.08544
total7.67356100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.