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Chemical content NPIC6C595PW

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Type numberPackagePackage descriptionTotal product weight
NPIC6C595PWSOT403-1TSSOP1684.87444 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352972711181112601235Singapore, Singapore; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-43.3642080.100003.96374
PolymerResin systemProprietary0.8358019.900000.98475
subTotal4.20000100.000004.94849
DieDoped siliconSilicon (Si)7440-21-30.91376100.000001.07660
subTotal0.91376100.000001.07660
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700043.63929
Iron (Fe)7439-89-60.912002.400001.07453
Phosphorus (P)7723-14-00.011400.030000.01343
Zinc (Zn)7440-66-60.038000.100000.04477
subTotal38.00000100.0000044.77202
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-735.4000088.5000041.70867
Flame retardantNon hazardousProprietary1.200003.000001.41385
PolymerEpoxy resin systemProprietary3.400008.500004.00592
subTotal40.00000100.0000047.12844
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.01767
Nickel (Ni)7440-02-01.4550097.000001.71430
Palladium (Pd)7440-05-30.030002.000000.03535
subTotal1.50000100.000001.76732
WirePure metalGold (Au)7440-57-50.2580799.000000.30406
Palladium (Pd)7440-05-30.002611.000000.00307
subTotal0.26068100.000000.30713
total84.87444100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.