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Chemical content NPIC6C596ABQ

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Type numberPackagePackage descriptionTotal product weight
NPIC6C596ABQSOT763-1DHVQFN1621.68454 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353024071151512601235Singapore, Singapore; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0720980.100000.33245
PolymerResin systemProprietary0.0179119.900000.08259
subTotal0.09000100.000000.41504
DieDoped siliconSilicon (Si)7440-21-30.91376100.000004.21389
subTotal0.91376100.000004.21389
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.6026697.4700035.06028
Iron (Fe)7439-89-60.187202.400000.86329
Phosphorus (P)7723-14-00.002340.030000.01079
Zinc (Zn)7440-66-60.007800.100000.03597
subTotal7.80000100.0000035.97033
Mould CompoundFillerSilica -amorphous-7631-86-91.001497.980004.61845
Silica fused60676-86-010.0515580.0920046.35351
PigmentCarbon black1333-86-40.116460.928000.53708
PolymerEpoxy resin systemProprietary1.060488.450004.89047
Phenolic resinProprietary0.320022.550001.47582
subTotal12.55000100.0000057.87533
Pre-PlatingPure metal layerGold (Au)7440-57-50.008103.000000.03735
Nickel (Ni)7440-02-00.2492192.300001.14925
Palladium (Pd)7440-05-30.008373.100000.03860
Silver (Ag)7440-22-40.004321.600000.01992
subTotal0.27000100.000001.24512
WirePure metalCopper (Cu)7440-50-80.06078100.000000.28028
subTotal0.06078100.000000.28028
total21.68454100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.