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Chemical content NPIC6C596D

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Type numberPackagePackage descriptionTotal product weight
NPIC6C596DSOT109-1SO16144.51128 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352972731181012601235Singapore, Singapore; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.8811080.100000.60971
PolymerResin systemProprietary0.2189019.900000.15148
subTotal1.10000100.000000.76119
DieDoped siliconSilicon (Si)7440-21-30.91376100.000000.63231
subTotal0.91376100.000000.63231
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-850.6844097.4700035.07297
Iron (Fe)7439-89-61.248002.400000.86360
Phosphorus (P)7723-14-00.015600.030000.01080
Zinc (Zn)7440-66-60.052000.100000.03598
subTotal52.00000100.0000035.98335
Mould CompoundAdditiveNon hazardousProprietary4.230004.700002.92711
FillerSilica fused60676-86-071.1000079.0000049.20031
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.400006.000003.73673
PigmentCarbon black1333-86-40.180000.200000.12456
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.600004.000002.49116
Non hazardousProprietary3.690004.100002.55343
Tetramethylbiphenyl diglycidyl ether85954-11-61.800002.000001.24558
subTotal90.00000100.0000062.27888
Pre-PlatingPure metal layerGold (Au)7440-57-50.002001.000000.00138
Nickel (Ni)7440-02-00.1940097.000000.13425
Palladium (Pd)7440-05-30.004002.000000.00277
subTotal0.20000100.000000.13840
WirePure metalGold (Au)7440-57-50.2945599.000000.20382
Palladium (Pd)7440-05-30.002981.000000.00206
subTotal0.29752100.000000.20588
total144.51128100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.