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Chemical content PBSS9410PA

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Type numberPackagePackage descriptionTotal product weight
PBSS9410PASOT1061HUSON38.07828 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340639261158126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01362
FillerSilver (Ag)7440-22-40.0924084.000001.14381
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.13617
Isobornyl Methacrylate7534-94-30.005505.000000.06808
subTotal0.11000100.000001.36168
DieDoped siliconSilicon (Si)7440-21-30.69000100.000008.54142
subTotal0.69000100.000008.54142
Lead FrameCopper alloyCopper (Cu)7440-50-82.6413794.2000032.69716
Magnesium (Mg)7439-95-40.008410.300000.10413
Nickel (Ni)7440-02-00.098143.500001.21486
Silicon (Si)7440-21-30.024390.870000.30198
Pure metal layerGold (Au)7440-57-50.001120.040000.01388
Nickel (Ni)7440-02-00.028041.000000.34710
Palladium (Pd)7440-05-30.002520.090000.03124
subTotal2.80400100.0000034.71035
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.21621
FillerSilica -amorphous-7631-86-90.012350.290000.15293
Silica fused60676-86-03.6699986.1500045.43034
HardenerPhenolic resinProprietary0.182754.290002.26229
PigmentCarbon black1333-86-40.008090.190000.10019
PolymerEpoxy resin systemProprietary0.369348.670004.57204
subTotal4.26000100.0000052.73400
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00009
Non hazardousProprietary0.000090.055500.00117
Tin solderTin (Sn)7440-31-50.1699099.940002.10315
subTotal0.17000100.000002.10441
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalCopper (Cu)7440-50-80.0442799.990000.54802
subTotal0.04428100.000000.54807
total8.07828100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.